■多种压电陶瓷材料配方体系。
A variety of piezoelectric ceramic material formulation system.
■先进流延工艺,多层叠膜,高压成型,高温烧结。
Advanced flow process, laminated film, high pressure molding and high temperaturesintering.
■独特的双晶片制备工艺,具有优良的机械偏转性能。
The particular double chip preparation technology has excellent mechanism deflection.
■高可靠性,超过20亿次的偏转周期。
High relibility with more than 2 bllion times of the deflection periodic.
■体积小,便于灵活的设计安装。
Small volume,convenient for flexible design and installation.